Market Research Report

Wafer Grinder (Wafer Thinning Equipment) Market, Global Outlook and Forecast 2023-2029

  • AMR ID : 7-14331
  • CAT ID : 10
  • Pages : 113
  • Date : Jun 2023
 

The global Wafer Grinder (Wafer Thinning Equipment) market was valued at US$ 841 million in 2022 and is projected to reach US$ 1285.5 million by 2029, at a CAGR of 6.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of wafer grinder (wafer thinning equipment) include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, etc. Global top three manufacturers hold a share over 84%. Japan is the largest producer of wafer grinder (wafer thinning equipment) holds a share over 57%. In terms of product, full automatic is the largest segment, with a share over 68%. And in terms of application, the largest application is 300 mm wafer, with a share over 78%.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinder (Wafer Thinning Equipment), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinder (Wafer Thinning Equipment). This report contains market size and forecasts of Wafer Grinder (Wafer Thinning Equipment) in global, including the following market information:
Global Wafer Grinder (Wafer Thinning Equipment) Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer Grinder (Wafer Thinning Equipment) Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Wafer Grinder (Wafer Thinning Equipment) companies in 2022 (%)
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Grinder (Wafer Thinning Equipment) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Grinder (Wafer Thinning Equipment) Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) Market Segment Percentages, by Type, 2022 (%)
Full Automatic
Semi Automatic
Global Wafer Grinder (Wafer Thinning Equipment) Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) Market Segment Percentages, by Application, 2022 (%)
200 mm Wafer
300 mm Wafer
Others
Global Wafer Grinder (Wafer Thinning Equipment) Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Grinder (Wafer Thinning Equipment) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Grinder (Wafer Thinning Equipment) revenues share in global market, 2022 (%)
Key companies Wafer Grinder (Wafer Thinning Equipment) sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Grinder (Wafer Thinning Equipment) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Grinder (Wafer Thinning Equipment), market overview.
Chapter 2: Global Wafer Grinder (Wafer Thinning Equipment) market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Grinder (Wafer Thinning Equipment) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Grinder (Wafer Thinning Equipment) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Grinder (Wafer Thinning Equipment) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
1.1 Wafer Grinder (Wafer Thinning Equipment) Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Wafer Grinder (Wafer Thinning Equipment) Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Wafer Grinder (Wafer Thinning Equipment) Overall Market Size
2.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Size: 2022 VS 2029
2.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales: 2018-2029
3 Company Landscape
3.1 Top Wafer Grinder (Wafer Thinning Equipment) Players in Global Market
3.2 Top Global Wafer Grinder (Wafer Thinning Equipment) Companies Ranked by Revenue
3.3 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Companies
3.4 Global Wafer Grinder (Wafer Thinning Equipment) Sales by Companies
3.5 Global Wafer Grinder (Wafer Thinning Equipment) Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Wafer Grinder (Wafer Thinning Equipment) Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Wafer Grinder (Wafer Thinning Equipment) Product Type
3.8 Tier 1, Tier 2 and Tier 3 Wafer Grinder (Wafer Thinning Equipment) Players in Global Market
3.8.1 List of Global Tier 1 Wafer Grinder (Wafer Thinning Equipment) Companies
3.8.2 List of Global Tier 2 and Tier 3 Wafer Grinder (Wafer Thinning Equipment) Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Market Size Markets, 2022 & 2029
4.1.2 Full Automatic
4.1.3 Semi Automatic
4.2 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Revenue & Forecasts
4.2.1 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2023
4.2.2 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Revenue, 2024-2029
4.2.3 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Revenue Market Share, 2018-2029
4.3 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Sales & Forecasts
4.3.1 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2023
4.3.2 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Sales, 2024-2029
4.3.3 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share, 2018-2029
4.4 By Type - Global Wafer Grinder (Wafer Thinning Equipment) Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Market Size, 2022 & 2029
5.1.2 200 mm Wafer
5.1.3 300 mm Wafer
5.1.4 Others
5.2 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Revenue & Forecasts
5.2.1 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2023
5.2.2 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Revenue, 2024-2029
5.2.3 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Revenue Market Share, 2018-2029
5.3 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Sales & Forecasts
5.3.1 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2023
5.3.2 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Sales, 2024-2029
5.3.3 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share, 2018-2029
5.4 By Application - Global Wafer Grinder (Wafer Thinning Equipment) Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Market Size, 2022 & 2029
6.2 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Revenue & Forecasts
6.2.1 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2023
6.2.2 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Revenue, 2024-2029
6.2.3 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Revenue Market Share, 2018-2029
6.3 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Sales & Forecasts
6.3.1 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2023
6.3.2 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Sales, 2024-2029
6.3.3 By Region - Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country - North America Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2029
6.4.2 By Country - North America Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2029
6.4.3 US Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.4.4 Canada Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.4.5 Mexico Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5 Europe
6.5.1 By Country - Europe Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2029
6.5.2 By Country - Europe Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2029
6.5.3 Germany Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5.4 France Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5.5 U.K. Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5.6 Italy Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5.7 Russia Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5.8 Nordic Countries Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.5.9 Benelux Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.6 Asia
6.6.1 By Region - Asia Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2029
6.6.2 By Region - Asia Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2029
6.6.3 China Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.6.4 Japan Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.6.5 South Korea Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.6.6 Southeast Asia Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.6.7 India Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.7 South America
6.7.1 By Country - South America Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2029
6.7.2 By Country - South America Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2029
6.7.3 Brazil Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.7.4 Argentina Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Revenue, 2018-2029
6.8.2 By Country - Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales, 2018-2029
6.8.3 Turkey Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.8.4 Israel Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.8.5 Saudi Arabia Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
6.8.6 UAE Wafer Grinder (Wafer Thinning Equipment) Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Disco
7.1.1 Disco Company Summary
7.1.2 Disco Business Overview
7.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.1.4 Disco Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.1.5 Disco Key News & Latest Developments
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Company Summary
7.2.2 TOKYO SEIMITSU Business Overview
7.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.2.4 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.2.5 TOKYO SEIMITSU Key News & Latest Developments
7.3 G&N
7.3.1 G&N Company Summary
7.3.2 G&N Business Overview
7.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.3.4 G&N Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.3.5 G&N Key News & Latest Developments
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Company Summary
7.4.2 Okamoto Semiconductor Equipment Division Business Overview
7.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.4.4 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.4.5 Okamoto Semiconductor Equipment Division Key News & Latest Developments
7.5 CETC
7.5.1 CETC Company Summary
7.5.2 CETC Business Overview
7.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.5.4 CETC Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.5.5 CETC Key News & Latest Developments
7.6 Koyo Machinery
7.6.1 Koyo Machinery Company Summary
7.6.2 Koyo Machinery Business Overview
7.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.6.4 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.6.5 Koyo Machinery Key News & Latest Developments
7.7 Revasum
7.7.1 Revasum Company Summary
7.7.2 Revasum Business Overview
7.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.7.4 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.7.5 Revasum Key News & Latest Developments
7.8 Daitron
7.8.1 Daitron Company Summary
7.8.2 Daitron Business Overview
7.8.3 Daitron Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.8.4 Daitron Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.8.5 Daitron Key News & Latest Developments
7.9 WAIDA MFG
7.9.1 WAIDA MFG Company Summary
7.9.2 WAIDA MFG Business Overview
7.9.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.9.4 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.9.5 WAIDA MFG Key News & Latest Developments
7.10 Hunan Yujing Machine Industrial
7.10.1 Hunan Yujing Machine Industrial Company Summary
7.10.2 Hunan Yujing Machine Industrial Business Overview
7.10.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.10.4 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.10.5 Hunan Yujing Machine Industrial Key News & Latest Developments
7.11 SpeedFam
7.11.1 SpeedFam Company Summary
7.11.2 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Business Overview
7.11.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Major Product Offerings
7.11.4 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales and Revenue in Global (2018-2023)
7.11.5 SpeedFam Key News & Latest Developments
8 Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity, Analysis
8.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity, 2018-2029
8.2 Wafer Grinder (Wafer Thinning Equipment) Production Capacity of Key Manufacturers in Global Market
8.3 Global Wafer Grinder (Wafer Thinning Equipment) Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Wafer Grinder (Wafer Thinning Equipment) Supply Chain Analysis
10.1 Wafer Grinder (Wafer Thinning Equipment) Industry Value Chain
10.2 Wafer Grinder (Wafer Thinning Equipment) Upstream Market
10.3 Wafer Grinder (Wafer Thinning Equipment) Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Wafer Grinder (Wafer Thinning Equipment) Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

 
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Frequently Asked Questions

The report efficiently evaluates the market from various dimensions to deliver an end-product that is informative, elaborate, and accurate and includes detailed market segmentation, regional analysis, and competitive landscape of the industry.
The report efficiently evaluates the current market size and provides industry forecast. The market was valued at xx Million US$ in 2019, and is expected to grow at a CAGR of xx% during the period 2020-2027.
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Market is segmented by Types, Applications, Technology, End-use Industries, and Regions.
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