Market Research Report

Wafer Cutting Scribing Machine Market, Global Outlook and Forecast 2023-2029

  • AMR ID : 7-4099
  • CAT ID : 10
  • Pages : 112
  • Date : Jun 2023
 

The global Wafer Cutting Scribing Machine market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Grinding Wheel Scribing Machine Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Wafer Cutting Scribing Machine include DISCO, Genesem, Tokyo Seimitsu, ASMPT, EO Technics, 3D-Micromac AG, Fujitsu Microelectronics, GL Tech and Han's Laser Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
Wafer Cutting Scribing Machine is a tool used in semiconductor manufacturing to cut and separate wafers into individual chips. Scribing machines use a diamond-tipped blade or laser to make precise cuts on the surface of the wafer, creating lines that weaken the material and allow it to be broken cleanly along the cut lines.
This report aims to provide a comprehensive presentation of the global market for Wafer Cutting Scribing Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Cutting Scribing Machine. This report contains market size and forecasts of Wafer Cutting Scribing Machine in global, including the following market information:
Global Wafer Cutting Scribing Machine Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer Cutting Scribing Machine Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Wafer Cutting Scribing Machine companies in 2022 (%)
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Cutting Scribing Machine manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Cutting Scribing Machine Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Cutting Scribing Machine Market Segment Percentages, by Type, 2022 (%)
Grinding Wheel Scribing Machine
Laser Scribing Machine
Global Wafer Cutting Scribing Machine Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Cutting Scribing Machine Market Segment Percentages, by Application, 2022 (%)
Semiconductor Packaging and Testing
EMC Leadframe
Ceramic Sheet
Others
Global Wafer Cutting Scribing Machine Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Cutting Scribing Machine Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Cutting Scribing Machine revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Cutting Scribing Machine revenues share in global market, 2022 (%)
Key companies Wafer Cutting Scribing Machine sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Cutting Scribing Machine sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO
Genesem
Tokyo Seimitsu
ASMPT
EO Technics
3D-Micromac AG
Fujitsu Microelectronics
GL Tech
Han's Laser Technology
China Electronics Technology Group
JCET Group
Wuxi Autowell Technology
Suzhou Delphi Laser
Shenzhen Guangyuan Intelligent
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Cutting Scribing Machine, market overview.
Chapter 2: Global Wafer Cutting Scribing Machine market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Cutting Scribing Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Cutting Scribing Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Cutting Scribing Machine capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
1.1 Wafer Cutting Scribing Machine Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Wafer Cutting Scribing Machine Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Wafer Cutting Scribing Machine Overall Market Size
2.1 Global Wafer Cutting Scribing Machine Market Size: 2022 VS 2029
2.2 Global Wafer Cutting Scribing Machine Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Wafer Cutting Scribing Machine Sales: 2018-2029
3 Company Landscape
3.1 Top Wafer Cutting Scribing Machine Players in Global Market
3.2 Top Global Wafer Cutting Scribing Machine Companies Ranked by Revenue
3.3 Global Wafer Cutting Scribing Machine Revenue by Companies
3.4 Global Wafer Cutting Scribing Machine Sales by Companies
3.5 Global Wafer Cutting Scribing Machine Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Wafer Cutting Scribing Machine Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Wafer Cutting Scribing Machine Product Type
3.8 Tier 1, Tier 2 and Tier 3 Wafer Cutting Scribing Machine Players in Global Market
3.8.1 List of Global Tier 1 Wafer Cutting Scribing Machine Companies
3.8.2 List of Global Tier 2 and Tier 3 Wafer Cutting Scribing Machine Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global Wafer Cutting Scribing Machine Market Size Markets, 2022 & 2029
4.1.2 Grinding Wheel Scribing Machine
4.1.3 Laser Scribing Machine
4.2 By Type - Global Wafer Cutting Scribing Machine Revenue & Forecasts
4.2.1 By Type - Global Wafer Cutting Scribing Machine Revenue, 2018-2023
4.2.2 By Type - Global Wafer Cutting Scribing Machine Revenue, 2024-2029
4.2.3 By Type - Global Wafer Cutting Scribing Machine Revenue Market Share, 2018-2029
4.3 By Type - Global Wafer Cutting Scribing Machine Sales & Forecasts
4.3.1 By Type - Global Wafer Cutting Scribing Machine Sales, 2018-2023
4.3.2 By Type - Global Wafer Cutting Scribing Machine Sales, 2024-2029
4.3.3 By Type - Global Wafer Cutting Scribing Machine Sales Market Share, 2018-2029
4.4 By Type - Global Wafer Cutting Scribing Machine Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Wafer Cutting Scribing Machine Market Size, 2022 & 2029
5.1.2 Semiconductor Packaging and Testing
5.1.3 EMC Leadframe
5.1.4 Ceramic Sheet
5.1.5 Others
5.2 By Application - Global Wafer Cutting Scribing Machine Revenue & Forecasts
5.2.1 By Application - Global Wafer Cutting Scribing Machine Revenue, 2018-2023
5.2.2 By Application - Global Wafer Cutting Scribing Machine Revenue, 2024-2029
5.2.3 By Application - Global Wafer Cutting Scribing Machine Revenue Market Share, 2018-2029
5.3 By Application - Global Wafer Cutting Scribing Machine Sales & Forecasts
5.3.1 By Application - Global Wafer Cutting Scribing Machine Sales, 2018-2023
5.3.2 By Application - Global Wafer Cutting Scribing Machine Sales, 2024-2029
5.3.3 By Application - Global Wafer Cutting Scribing Machine Sales Market Share, 2018-2029
5.4 By Application - Global Wafer Cutting Scribing Machine Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region - Global Wafer Cutting Scribing Machine Market Size, 2022 & 2029
6.2 By Region - Global Wafer Cutting Scribing Machine Revenue & Forecasts
6.2.1 By Region - Global Wafer Cutting Scribing Machine Revenue, 2018-2023
6.2.2 By Region - Global Wafer Cutting Scribing Machine Revenue, 2024-2029
6.2.3 By Region - Global Wafer Cutting Scribing Machine Revenue Market Share, 2018-2029
6.3 By Region - Global Wafer Cutting Scribing Machine Sales & Forecasts
6.3.1 By Region - Global Wafer Cutting Scribing Machine Sales, 2018-2023
6.3.2 By Region - Global Wafer Cutting Scribing Machine Sales, 2024-2029
6.3.3 By Region - Global Wafer Cutting Scribing Machine Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country - North America Wafer Cutting Scribing Machine Revenue, 2018-2029
6.4.2 By Country - North America Wafer Cutting Scribing Machine Sales, 2018-2029
6.4.3 US Wafer Cutting Scribing Machine Market Size, 2018-2029
6.4.4 Canada Wafer Cutting Scribing Machine Market Size, 2018-2029
6.4.5 Mexico Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5 Europe
6.5.1 By Country - Europe Wafer Cutting Scribing Machine Revenue, 2018-2029
6.5.2 By Country - Europe Wafer Cutting Scribing Machine Sales, 2018-2029
6.5.3 Germany Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5.4 France Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5.5 U.K. Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5.6 Italy Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5.7 Russia Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5.8 Nordic Countries Wafer Cutting Scribing Machine Market Size, 2018-2029
6.5.9 Benelux Wafer Cutting Scribing Machine Market Size, 2018-2029
6.6 Asia
6.6.1 By Region - Asia Wafer Cutting Scribing Machine Revenue, 2018-2029
6.6.2 By Region - Asia Wafer Cutting Scribing Machine Sales, 2018-2029
6.6.3 China Wafer Cutting Scribing Machine Market Size, 2018-2029
6.6.4 Japan Wafer Cutting Scribing Machine Market Size, 2018-2029
6.6.5 South Korea Wafer Cutting Scribing Machine Market Size, 2018-2029
6.6.6 Southeast Asia Wafer Cutting Scribing Machine Market Size, 2018-2029
6.6.7 India Wafer Cutting Scribing Machine Market Size, 2018-2029
6.7 South America
6.7.1 By Country - South America Wafer Cutting Scribing Machine Revenue, 2018-2029
6.7.2 By Country - South America Wafer Cutting Scribing Machine Sales, 2018-2029
6.7.3 Brazil Wafer Cutting Scribing Machine Market Size, 2018-2029
6.7.4 Argentina Wafer Cutting Scribing Machine Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa Wafer Cutting Scribing Machine Revenue, 2018-2029
6.8.2 By Country - Middle East & Africa Wafer Cutting Scribing Machine Sales, 2018-2029
6.8.3 Turkey Wafer Cutting Scribing Machine Market Size, 2018-2029
6.8.4 Israel Wafer Cutting Scribing Machine Market Size, 2018-2029
6.8.5 Saudi Arabia Wafer Cutting Scribing Machine Market Size, 2018-2029
6.8.6 UAE Wafer Cutting Scribing Machine Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 DISCO
7.1.1 DISCO Company Summary
7.1.2 DISCO Business Overview
7.1.3 DISCO Wafer Cutting Scribing Machine Major Product Offerings
7.1.4 DISCO Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.1.5 DISCO Key News & Latest Developments
7.2 Genesem
7.2.1 Genesem Company Summary
7.2.2 Genesem Business Overview
7.2.3 Genesem Wafer Cutting Scribing Machine Major Product Offerings
7.2.4 Genesem Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.2.5 Genesem Key News & Latest Developments
7.3 Tokyo Seimitsu
7.3.1 Tokyo Seimitsu Company Summary
7.3.2 Tokyo Seimitsu Business Overview
7.3.3 Tokyo Seimitsu Wafer Cutting Scribing Machine Major Product Offerings
7.3.4 Tokyo Seimitsu Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.3.5 Tokyo Seimitsu Key News & Latest Developments
7.4 ASMPT
7.4.1 ASMPT Company Summary
7.4.2 ASMPT Business Overview
7.4.3 ASMPT Wafer Cutting Scribing Machine Major Product Offerings
7.4.4 ASMPT Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.4.5 ASMPT Key News & Latest Developments
7.5 EO Technics
7.5.1 EO Technics Company Summary
7.5.2 EO Technics Business Overview
7.5.3 EO Technics Wafer Cutting Scribing Machine Major Product Offerings
7.5.4 EO Technics Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.5.5 EO Technics Key News & Latest Developments
7.6 3D-Micromac AG
7.6.1 3D-Micromac AG Company Summary
7.6.2 3D-Micromac AG Business Overview
7.6.3 3D-Micromac AG Wafer Cutting Scribing Machine Major Product Offerings
7.6.4 3D-Micromac AG Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.6.5 3D-Micromac AG Key News & Latest Developments
7.7 Fujitsu Microelectronics
7.7.1 Fujitsu Microelectronics Company Summary
7.7.2 Fujitsu Microelectronics Business Overview
7.7.3 Fujitsu Microelectronics Wafer Cutting Scribing Machine Major Product Offerings
7.7.4 Fujitsu Microelectronics Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.7.5 Fujitsu Microelectronics Key News & Latest Developments
7.8 GL Tech
7.8.1 GL Tech Company Summary
7.8.2 GL Tech Business Overview
7.8.3 GL Tech Wafer Cutting Scribing Machine Major Product Offerings
7.8.4 GL Tech Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.8.5 GL Tech Key News & Latest Developments
7.9 Han's Laser Technology
7.9.1 Han's Laser Technology Company Summary
7.9.2 Han's Laser Technology Business Overview
7.9.3 Han's Laser Technology Wafer Cutting Scribing Machine Major Product Offerings
7.9.4 Han's Laser Technology Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.9.5 Han's Laser Technology Key News & Latest Developments
7.10 China Electronics Technology Group
7.10.1 China Electronics Technology Group Company Summary
7.10.2 China Electronics Technology Group Business Overview
7.10.3 China Electronics Technology Group Wafer Cutting Scribing Machine Major Product Offerings
7.10.4 China Electronics Technology Group Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.10.5 China Electronics Technology Group Key News & Latest Developments
7.11 JCET Group
7.11.1 JCET Group Company Summary
7.11.2 JCET Group Wafer Cutting Scribing Machine Business Overview
7.11.3 JCET Group Wafer Cutting Scribing Machine Major Product Offerings
7.11.4 JCET Group Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.11.5 JCET Group Key News & Latest Developments
7.12 Wuxi Autowell Technology
7.12.1 Wuxi Autowell Technology Company Summary
7.12.2 Wuxi Autowell Technology Wafer Cutting Scribing Machine Business Overview
7.12.3 Wuxi Autowell Technology Wafer Cutting Scribing Machine Major Product Offerings
7.12.4 Wuxi Autowell Technology Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.12.5 Wuxi Autowell Technology Key News & Latest Developments
7.13 Suzhou Delphi Laser
7.13.1 Suzhou Delphi Laser Company Summary
7.13.2 Suzhou Delphi Laser Wafer Cutting Scribing Machine Business Overview
7.13.3 Suzhou Delphi Laser Wafer Cutting Scribing Machine Major Product Offerings
7.13.4 Suzhou Delphi Laser Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.13.5 Suzhou Delphi Laser Key News & Latest Developments
7.14 Shenzhen Guangyuan Intelligent
7.14.1 Shenzhen Guangyuan Intelligent Company Summary
7.14.2 Shenzhen Guangyuan Intelligent Business Overview
7.14.3 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Major Product Offerings
7.14.4 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Sales and Revenue in Global (2018-2023)
7.14.5 Shenzhen Guangyuan Intelligent Key News & Latest Developments
8 Global Wafer Cutting Scribing Machine Production Capacity, Analysis
8.1 Global Wafer Cutting Scribing Machine Production Capacity, 2018-2029
8.2 Wafer Cutting Scribing Machine Production Capacity of Key Manufacturers in Global Market
8.3 Global Wafer Cutting Scribing Machine Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Wafer Cutting Scribing Machine Supply Chain Analysis
10.1 Wafer Cutting Scribing Machine Industry Value Chain
10.2 Wafer Cutting Scribing Machine Upstream Market
10.3 Wafer Cutting Scribing Machine Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Wafer Cutting Scribing Machine Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

 
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