Market Research Report

SiC Wafer Laser Cutting Equipment Market, Global Outlook and Forecast 2023-2029

  • AMR ID : 7-19706
  • CAT ID : 10
  • Pages : 117
  • Date : Jun 2023
 

The global SiC Wafer Laser Cutting Equipment market was valued at US$ 94 million in 2022 and is projected to reach US$ 257.8 million by 2029, at a CAGR of 15.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region,Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.
Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.
This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Cutting Equipment. This report contains market size and forecasts of SiC Wafer Laser Cutting Equipment in global, including the following market information:
Global SiC Wafer Laser Cutting Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global SiC Wafer Laser Cutting Equipment Market Sales, 2018-2023, 2024-2029, (Units)
Global top five SiC Wafer Laser Cutting Equipment companies in 2022 (%)
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the SiC Wafer Laser Cutting Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global SiC Wafer Laser Cutting Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global SiC Wafer Laser Cutting Equipment Market Segment Percentages, by Type, 2022 (%)
Processing Sizes up to 6 Inches
Processing Sizes up to 8 Inches
Global SiC Wafer Laser Cutting Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global SiC Wafer Laser Cutting Equipment Market Segment Percentages, by Application, 2022 (%)
Foundry
IDM
Global SiC Wafer Laser Cutting Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global SiC Wafer Laser Cutting Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies SiC Wafer Laser Cutting Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies SiC Wafer Laser Cutting Equipment revenues share in global market, 2022 (%)
Key companies SiC Wafer Laser Cutting Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies SiC Wafer Laser Cutting Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO Corporation
Suzhou Delphi Laser Co
Han's Laser Technology
3D-Micromac
Synova S.A.
HGTECH
ASMPT
GHN.GIE
Wuhan DR Laser Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of SiC Wafer Laser Cutting Equipment, market overview.
Chapter 2: Global SiC Wafer Laser Cutting Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of SiC Wafer Laser Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global SiC Wafer Laser Cutting Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
1.1 SiC Wafer Laser Cutting Equipment Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global SiC Wafer Laser Cutting Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global SiC Wafer Laser Cutting Equipment Overall Market Size
2.1 Global SiC Wafer Laser Cutting Equipment Market Size: 2022 VS 2029
2.2 Global SiC Wafer Laser Cutting Equipment Revenue, Prospects & Forecasts: 2018-2029
2.3 Global SiC Wafer Laser Cutting Equipment Sales: 2018-2029
3 Company Landscape
3.1 Top SiC Wafer Laser Cutting Equipment Players in Global Market
3.2 Top Global SiC Wafer Laser Cutting Equipment Companies Ranked by Revenue
3.3 Global SiC Wafer Laser Cutting Equipment Revenue by Companies
3.4 Global SiC Wafer Laser Cutting Equipment Sales by Companies
3.5 Global SiC Wafer Laser Cutting Equipment Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 SiC Wafer Laser Cutting Equipment Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers SiC Wafer Laser Cutting Equipment Product Type
3.8 Tier 1, Tier 2 and Tier 3 SiC Wafer Laser Cutting Equipment Players in Global Market
3.8.1 List of Global Tier 1 SiC Wafer Laser Cutting Equipment Companies
3.8.2 List of Global Tier 2 and Tier 3 SiC Wafer Laser Cutting Equipment Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global SiC Wafer Laser Cutting Equipment Market Size Markets, 2022 & 2029
4.1.2 Processing Sizes up to 6 Inches
4.1.3 Processing Sizes up to 8 Inches
4.2 By Type - Global SiC Wafer Laser Cutting Equipment Revenue & Forecasts
4.2.1 By Type - Global SiC Wafer Laser Cutting Equipment Revenue, 2018-2023
4.2.2 By Type - Global SiC Wafer Laser Cutting Equipment Revenue, 2024-2029
4.2.3 By Type - Global SiC Wafer Laser Cutting Equipment Revenue Market Share, 2018-2029
4.3 By Type - Global SiC Wafer Laser Cutting Equipment Sales & Forecasts
4.3.1 By Type - Global SiC Wafer Laser Cutting Equipment Sales, 2018-2023
4.3.2 By Type - Global SiC Wafer Laser Cutting Equipment Sales, 2024-2029
4.3.3 By Type - Global SiC Wafer Laser Cutting Equipment Sales Market Share, 2018-2029
4.4 By Type - Global SiC Wafer Laser Cutting Equipment Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global SiC Wafer Laser Cutting Equipment Market Size, 2022 & 2029
5.1.2 Foundry
5.1.3 IDM
5.2 By Application - Global SiC Wafer Laser Cutting Equipment Revenue & Forecasts
5.2.1 By Application - Global SiC Wafer Laser Cutting Equipment Revenue, 2018-2023
5.2.2 By Application - Global SiC Wafer Laser Cutting Equipment Revenue, 2024-2029
5.2.3 By Application - Global SiC Wafer Laser Cutting Equipment Revenue Market Share, 2018-2029
5.3 By Application - Global SiC Wafer Laser Cutting Equipment Sales & Forecasts
5.3.1 By Application - Global SiC Wafer Laser Cutting Equipment Sales, 2018-2023
5.3.2 By Application - Global SiC Wafer Laser Cutting Equipment Sales, 2024-2029
5.3.3 By Application - Global SiC Wafer Laser Cutting Equipment Sales Market Share, 2018-2029
5.4 By Application - Global SiC Wafer Laser Cutting Equipment Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region - Global SiC Wafer Laser Cutting Equipment Market Size, 2022 & 2029
6.2 By Region - Global SiC Wafer Laser Cutting Equipment Revenue & Forecasts
6.2.1 By Region - Global SiC Wafer Laser Cutting Equipment Revenue, 2018-2023
6.2.2 By Region - Global SiC Wafer Laser Cutting Equipment Revenue, 2024-2029
6.2.3 By Region - Global SiC Wafer Laser Cutting Equipment Revenue Market Share, 2018-2029
6.3 By Region - Global SiC Wafer Laser Cutting Equipment Sales & Forecasts
6.3.1 By Region - Global SiC Wafer Laser Cutting Equipment Sales, 2018-2023
6.3.2 By Region - Global SiC Wafer Laser Cutting Equipment Sales, 2024-2029
6.3.3 By Region - Global SiC Wafer Laser Cutting Equipment Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country - North America SiC Wafer Laser Cutting Equipment Revenue, 2018-2029
6.4.2 By Country - North America SiC Wafer Laser Cutting Equipment Sales, 2018-2029
6.4.3 US SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.4.4 Canada SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.4.5 Mexico SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5 Europe
6.5.1 By Country - Europe SiC Wafer Laser Cutting Equipment Revenue, 2018-2029
6.5.2 By Country - Europe SiC Wafer Laser Cutting Equipment Sales, 2018-2029
6.5.3 Germany SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5.4 France SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5.5 U.K. SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5.6 Italy SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5.7 Russia SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5.8 Nordic Countries SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.5.9 Benelux SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.6 Asia
6.6.1 By Region - Asia SiC Wafer Laser Cutting Equipment Revenue, 2018-2029
6.6.2 By Region - Asia SiC Wafer Laser Cutting Equipment Sales, 2018-2029
6.6.3 China SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.6.4 Japan SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.6.5 South Korea SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.6.6 Southeast Asia SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.6.7 India SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.7 South America
6.7.1 By Country - South America SiC Wafer Laser Cutting Equipment Revenue, 2018-2029
6.7.2 By Country - South America SiC Wafer Laser Cutting Equipment Sales, 2018-2029
6.7.3 Brazil SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.7.4 Argentina SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa SiC Wafer Laser Cutting Equipment Revenue, 2018-2029
6.8.2 By Country - Middle East & Africa SiC Wafer Laser Cutting Equipment Sales, 2018-2029
6.8.3 Turkey SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.8.4 Israel SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.8.5 Saudi Arabia SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
6.8.6 UAE SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 DISCO Corporation
7.1.1 DISCO Corporation Company Summary
7.1.2 DISCO Corporation Business Overview
7.1.3 DISCO Corporation SiC Wafer Laser Cutting Equipment Major Product Offerings
7.1.4 DISCO Corporation SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.1.5 DISCO Corporation Key News & Latest Developments
7.2 Suzhou Delphi Laser Co
7.2.1 Suzhou Delphi Laser Co Company Summary
7.2.2 Suzhou Delphi Laser Co Business Overview
7.2.3 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Major Product Offerings
7.2.4 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.2.5 Suzhou Delphi Laser Co Key News & Latest Developments
7.3 Han's Laser Technology
7.3.1 Han's Laser Technology Company Summary
7.3.2 Han's Laser Technology Business Overview
7.3.3 Han's Laser Technology SiC Wafer Laser Cutting Equipment Major Product Offerings
7.3.4 Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.3.5 Han's Laser Technology Key News & Latest Developments
7.4 3D-Micromac
7.4.1 3D-Micromac Company Summary
7.4.2 3D-Micromac Business Overview
7.4.3 3D-Micromac SiC Wafer Laser Cutting Equipment Major Product Offerings
7.4.4 3D-Micromac SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.4.5 3D-Micromac Key News & Latest Developments
7.5 Synova S.A.
7.5.1 Synova S.A. Company Summary
7.5.2 Synova S.A. Business Overview
7.5.3 Synova S.A. SiC Wafer Laser Cutting Equipment Major Product Offerings
7.5.4 Synova S.A. SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.5.5 Synova S.A. Key News & Latest Developments
7.6 HGTECH
7.6.1 HGTECH Company Summary
7.6.2 HGTECH Business Overview
7.6.3 HGTECH SiC Wafer Laser Cutting Equipment Major Product Offerings
7.6.4 HGTECH SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.6.5 HGTECH Key News & Latest Developments
7.7 ASMPT
7.7.1 ASMPT Company Summary
7.7.2 ASMPT Business Overview
7.7.3 ASMPT SiC Wafer Laser Cutting Equipment Major Product Offerings
7.7.4 ASMPT SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.7.5 ASMPT Key News & Latest Developments
7.8 GHN.GIE
7.8.1 GHN.GIE Company Summary
7.8.2 GHN.GIE Business Overview
7.8.3 GHN.GIE SiC Wafer Laser Cutting Equipment Major Product Offerings
7.8.4 GHN.GIE SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.8.5 GHN.GIE Key News & Latest Developments
7.9 Wuhan DR Laser Technology
7.9.1 Wuhan DR Laser Technology Company Summary
7.9.2 Wuhan DR Laser Technology Business Overview
7.9.3 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Major Product Offerings
7.9.4 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales and Revenue in Global (2018-2023)
7.9.5 Wuhan DR Laser Technology Key News & Latest Developments
8 Global SiC Wafer Laser Cutting Equipment Production Capacity, Analysis
8.1 Global SiC Wafer Laser Cutting Equipment Production Capacity, 2018-2029
8.2 SiC Wafer Laser Cutting Equipment Production Capacity of Key Manufacturers in Global Market
8.3 Global SiC Wafer Laser Cutting Equipment Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 SiC Wafer Laser Cutting Equipment Supply Chain Analysis
10.1 SiC Wafer Laser Cutting Equipment Industry Value Chain
10.2 SiC Wafer Laser Cutting Equipment Upstream Market
10.3 SiC Wafer Laser Cutting Equipment Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 SiC Wafer Laser Cutting Equipment Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

 
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